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Model Number : XCZU17EG-2FFVD1760E
Payment Terms : D/A, T/T, Western Union
Delivery Time : 1-2 work days
Packaging Details : Tape & Reel (TR)
RAM Size : 256KB
Package / Case : 1760-BBGA, FCBGA
Packaging : Tray
Supplier Device Package : 1760-FCBGA (42.5x42.5)
Number of I/O : 308
Speed : 533MHz, 600MHz, 1.3GHz
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| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant | 
|---|---|
| Detailed Description: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5) | 
| Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
| Moisture Sensitivity Level (MSL): | 4 (72 Hours) | 
| Manufacturer Standard Lead Time: | 10 Weeks | 
| Core Processor: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
| Primary Attributes: | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | 
| Series: | Zynq® UltraScale+™ MPSoC EG | 
| Architecture: | MCU, FPGA | 
| Operating Temperature: | 0°C ~ 100°C (TJ) | 
| Peripherals: | DMA, WDT | 
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